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EM250
16 Revision History
Revision
1.1
V
U
T
S
R
Q
P
O
N
Location
Chapter 8 and Chapter 11 updated.
Datasheet
Chapter 12
Datasheet
Figure 17. Package Drawing for EM250s
assembled in Wales or China and Figure 19.
PCB Footprint for the EM250
Chapter 8 (new Figure 18. Package
Drawing for EM250s assembled in Malaysia)
and Chapter 11
SCn_SPICFG, SCn_RATEEXPO, and
SCn_RATELIN register descriptions
Section 5.3.1.2, SPI Slave Mode
Chapter 16
Table 1. Pin Descriptions
Section 5.7, Integrated Voltage Regulator
Chapter 11, Ordering Information, Error!
Reference source not found.
Figure 14. Timer Output Generation Mode
Example—Saw Tooth, Non-inverting
Figure 15. Timer Output Generation Mode
Example—Alternating, Non-inverting
Figure 19. PCB Footprint for the EM250
Figure 20. Paste Mask Dimensions
Table 5. DC Characteristics
Section 4.1.1, RX Baseband
Section 5.5, ADC Module
Table 33. ADC Module Key Parameters
Chapter 9, QFN48 Footprint
Recommendations
Chapter Error! Reference source not
found. , Error! Reference source not
found.
Table 39. Bill of Materials for Figure 16
Figure 21. Contents Label
Table 1. Pin Descriptions
Table 2. Absolute Maximum Ratings
Table 7. Receive Characteristics
Section 5.1, GPIO
Description of Change
SCM package updated and AESCL package added.
Updated cross references to Silicon Labs documentation.
Updated Figure 24.
Rebranding to Silicon Labs.
Corrected dimensions.
Added specifications for Malaysia manufacture.
Clarified the circumstances under which the registers can be changed.
Clarified state of MISO pin when nSSEL signal is deasserted; added
information about transmit behavior.
Updated reference information.
Updated the following pin descriptions: 1, 2, 5, 8, 10, 12, 18, 30, 39,
44, 45, and 46.
Updated section 5.7 to remove support for an external 1v8 regulator.
Removed Tray information and added Tube information according to
PCN 121-1006-000.
Corrected timer mode 5.
Corrected timer mode 5.
Corrected via dimensions.
Corrected via dimensions.
Added nRESET active current parameter.
Updated AGC information.
Added ADC information.
Added new table.
Added new chapter and figures.
Added new chapter and figures.
Updated BOM information.
Added new figure.
Added more detail around the SIF Interface pins.
Added a Maximum Input level in dBM.
Modified the 802.11g rejection from 40 to 35dB.
Added more detail around the GPIO output configuration.
Page 123
120-0082-000V Rev 1.1
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EM250-COMP-XIDE 制造商:Silicon Laboratories Inc 功能描述:COMPILER XIDE FOR EM250 1SEAT
EM250-DEV 功能描述:KIT DEV FOR EM250 RoHS:否 类别:RF/IF 和 RFID >> RF 评估和开发套件，板 系列:InSight 标准包装:1 系列:- 类型:GPS 接收器 频率:1575MHz 适用于相关产品:- 已供物品:模块 其它名称:SER3796
EM250-EK-R 功能描述:KIT EVAL EM250 RF TEST RoHS:是 类别:RF/IF 和 RFID >> 过时/停产零件编号 系列:InSight 标准包装:1 系列:- 类型:用于 200/300 系列的欧盟开发套件 适用于相关产品:Zensys RF 模块 所含物品:开发板，模块，编程器，软件，线缆，电源 其它名称:703-1019Q3225667
EM250-JMP-R 功能描述:KIT JUMP START FOR EM250 RoHS:否 类别:RF/IF 和 RFID >> RF 评估和开发套件，板 系列:JumpStart 标准包装:1 系列:- 类型:GPS 接收器 频率:1575MHz 适用于相关产品:- 已供物品:模块 其它名称:SER3796
EM250-RCM-R 功能描述:EM250 RCM BOARD RoHS:是 类别:RF/IF 和 RFID >> RF 评估和开发套件，板 系列:- 标准包装:1 系列:- 类型:GPS 接收器 频率:1575MHz 适用于相关产品:- 已供物品:模块 其它名称:SER3796
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EM250-STACK-R 制造商:Silicon Laboratories Inc 功能描述:EM250 BOARD STACK (RCM + BREAKOUT) - Boxed Product (Development Kits) 制造商:Silicon Laboratories Inc 功能描述:BOARD STACK EM250 RCM & BREAKOUT
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